TOKYO, August 30 – Prime Minister Narendra Modi departed for China on Saturday to participate in the Shanghai Cooperation Organisation (SCO) Summit after completing his two-day visit to Japan.
During Modi’s visit, India and Japan finalized 13 key agreements and announcements and declared the launch of several transformative initiatives.
The Prime Minister wrote on social media platform ‘X’, “This visit to Japan will be remembered for the beneficial outcomes that will serve the people of our country. I thank (Japan’s) Prime Minister (Shigeru) Ishiba, the Japanese public, and the government for their warmth.”
Before departing for China, Prime Minister Modi visited the semiconductor plant in Sendai, Miyagi Prefecture, Japan on Saturday.
A day earlier, India and Japan had pledged to deepen cooperation in the field of critical technology.
Modi arrived in Sendai via bullet train alongside his Japanese counterpart Ishiba. Sendai is located more than 300 kilometers from Tokyo.
Prime Minister Ishiba hosted a luncheon in Sendai in honor of Modi, which was attended by the Governor of Miyagi Prefecture and other dignitaries.
An Indian release stated that Prime Minister Modi’s visit to ‘Tokyo Electron Miyagi Limited’ (TEL Miyagi) in Sendai highlighted the complementarity between India’s developing semiconductor manufacturing ecosystem and Japan’s strength in this sector.
TEL Miyagi, a leading Japanese semiconductor company, is working on plans for collaboration with India.
Modi was briefed on TEL’s role in the global semiconductor value chain, its advanced manufacturing capabilities, and its ongoing and planned collaboration with India.
The Ministry of External Affairs (MEA) said in a statement that the visit provided the leaders of both countries with a practical understanding of the opportunities for enhancing cooperation in semiconductor supply chains, manufacturing, and testing.
The ministry stated, “Both sides reiterated their commitment to deepening cooperation in this sector, advancing partnerships under the Memorandum of Cooperation on Japan-India Semiconductor Supply Chain Partnership, as well as under the India-Japan Industrial Competitiveness Partnership and Economic Security Dialogue.”
It said that the joint tour of the plant by Modi and Ishiba also underscored the shared vision of India and Japan to develop strong, resilient, and reliable semiconductor supply chains.
The Ministry of External Affairs said, “Prime Minister Modi expressed gratitude to Japan’s Prime Minister Ishiba for accompanying him on the (plant) tour and reaffirmed India’s readiness to work together with Japan in this strategic sector.”
Modi and Ishiba held extensive discussions on Friday, which also focused on enhancing cooperation in the semiconductor sector.
Modi had arrived in Tokyo on Friday for the two-day visit.
On Friday, Japan set a target of investing 10 trillion yen (approximately ₹600,000 crore) in India over a decade, and the two sides signed several major agreements, including a framework for defense relations and a 10-year blueprint to promote economic partnership.
This decision was made amid economic turbulence caused by the trade and tariff policies of the administration of U.S. President Donald Trump.
Announcements regarding the expansion of the India-Japan Special Strategic and Global Partnership were made following summit talks between Prime Minister Modi and his Japanese counterpart Ishiba.
Both sides finalized 13 key agreements and documents and announced the launch of several transformative initiatives, including an economic security framework to promote supply chain resilience in strategic areas such as semiconductors, clean energy, telecommunications, pharmaceuticals, critical minerals, and new and emerging technologies.